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Go to Content Please enable Javascript to use all functions. MENU CLOSE Inquiry Access Japanese Japanese Search Frequently searched keywords hydrogen fuel cell FH2R ammonia artificial intelligence News News News List Topics (Photo Gallery) Events Events Current Events Past Events Activities Activities Project Fields Energy Environment Mechanical systems Electronics and telecommunications Materials and nanotechnology Biotechnology International expansion support Global warming countermeasures Cross-sectoral proposal-based activities Industry-academia collaboration / human resource development Surveys, evaluations, and other activities Pickup Publications Publications Brochures Focus NEDO Reports NEDO　Channel About NEDO About NEDO Chairman's Message Budget Technology Development Fields NEDO's Initiatives--> Background Information Executives Organization Domestic offices Overseas offices Washington, D.C. Silicon Valley Bangkok Beijing Europe New Delhi Links Frequently searched keywords hydrogen fuel cell FH2R ammonia artificial intelligence Inquiry Access Home Activities Electronics and telecommunications Networks and computing Development of Technology for Building a Chiplet Design Platform Development of Technology for Building a Chiplet Design Platform Project overview FY2023 to FY2027, budget: 500 million yen (FY2023) It is essential to process information at the network edge in order to advance digitization technology toward the realization of Society 5.0. For AI semiconductors to be used in information processing, there has been an acceleration of efforts, including standardization mainly in the United States, to develop a technology called a chiplet* in order to suppress the increase of design and manufacturing costs with maintaining high performance as one of the post-Moore technologies. It has become necessary for Japan to take immediate action as well. As this project closely monitors the standardization trend of chiplet technology in the world, it promotes technological development for the establishment of chiplet design platform to easily realize semiconductors that achieve both performance and low-cost and aims to make it a fundamental technology that can be widely used by private enterprises and other entities. In addition, the project develops AI semiconductor chips that can be mounted on the customized SoCs of chiplet-type, and pursues reliable applications in society. Platform of chiplet-type and R&D elements of the Project *Chiplet technology is a technology that packages together as a single chip by dividing the CPU, GPU, accelerator, and other components, composing an integrated circuit into multiple chips, manufacturing each chip using an optimized process, and combining them. Compared to the conventional manufacturing method, where integrated circuits are manufactured on a single chip using the same process, it is expected to result in both cost reduction and high-performance.​ Research and Development (1) Development of Fundamental Technology for the Customized SoC Design of Chiplet-type NEDO will select an implementer to develop fundamental technology for the customized SoC design of chiplet-type, and launch into the research process. At the start of the research, this project will investigate the latest trends in domestic and international technologies and standards related to chiplet technology. Basic information Technical field Networks and computing Project code P23009 Department in charge Internet of Things Promotion Department (TEL: +81-44-520-5211) Last Updated : December 26, 2023 　　　Top Terms of Website Use Privacy Policy New Energy and Industrial Technology Development Organization JCN（Japan Corporate Number） 2020005008480© New Energy and Industrial Technology Development Organization. All rights reserved.